Optimizing Robotic Disassembly-Assembly Line Balancing with Directional Switching Time via an Improved Q(λ) Algorithm in IoT-Enabled Smart Manufacturing

With the growing adoption of circular economy principles in manufacturing, efficient disassembly and reassembly of end-of-life (EOL) products has become a key challenge in smart factories. This paper addresses the Disassembly and Assembly Line Balancing Problem (DALBP), which involves scheduling robotic tasks across workstations while minimizing total operation time and accounting for directional switching time between disassembly and assembly phases. To solve this problem, we propose an improved reinforcement learning algorithm, IQ((Formula presented.)), which extends the classical Q((Formula presented.)) method by incorporating eligibility trace decay, a dynamic Action Table mechanism to handle non-conflicting parallel tasks, and switching-aware reward shaping to penalize inefficient task transitions. Compared with standard Q((Formula presented.)), these modifications enhance the algorithm’s global search capability, accelerate convergence, and improve solution quality in complex DALBP scenarios. While the current implementation does not deploy live IoT infrastructure, the architecture is modular and designed to support future extensions involving edge-cloud coordination, trust-aware optimization, and privacy-preserving learning in Industrial Internet of Things (IIoT) environments. Four real-world disassembly-assembly cases (flashlight, copier, battery, and hammer drill) are used to evaluate the algorithm’s effectiveness. Experimental results show that IQ((Formula presented.)) consistently outperforms traditional Q-learning, Q((Formula presented.)), and Sarsa in terms of solution quality, convergence speed, and robustness. Furthermore, ablation studies and sensitivity analysis confirm the importance of the algorithm’s core design components. This work provides a scalable and extensible framework for intelligent scheduling in cyber-physical manufacturing systems and lays a foundation for future integration with secure, IoT-connected environments.