TY - JOUR
T1 - Clues to the electrical switching mechanism of carbazole-containing polyimide thin films
AU - Ree, Brian J.
AU - Kwon, Wonsang
AU - Kim, Kyungtae
AU - Ko, Yong Gi
AU - Kim, Young Yong
AU - Lee, Hoyeol
AU - Ree, Moonhor
N1 - Publisher Copyright:
© 2014 American Chemical Society.
PY - 2014/12/10
Y1 - 2014/12/10
N2 - The mechanism behind electrical memory behavior of carbazole-containing polyimides (PIs) in nanoscale thin films was investigated. For this investigation, a series of poly(3,3′-dihydroxy-4,4′-biphenylene-co-3,3′-bis(N-ethylenyloxycarbazole)-4,4′-biphenylene hexafluoro-isopropylidenedi-phthalimide)s (6F-HAB-HABCZn PIs) with various compositions was synthesized as a model carbazole-containing polymer system. The thermal properties, band gaps, and molecular orbital levels of the PIs were determined. Furthermore, the chemical compositions, as well as the nanoscale thin film morphologies and electron densities, were analyzed, providing detailed information on the population and positional distribution of carbazole moieties in thin films of the PIs. PI Devices were fabricated with aluminum electrodes and tested electrically. The PI thin film layers in the devices exhibited electrically permanent memory behavior, which was driven by trap-limited space-charge limited conduction and ohmic conduction. The permanent memory characteristics were found to be attributed to the incorporated carbazole moieties rather than from the other chemical components. Furthermore, the memory characteristics depended significantly on the population and positional distribution of carbazole moieties in the PI layer, as well as the film thickness. Considering that the backbone is not conjugated, the present results collectively indicate that the electrical switching behavior of the PI films is driven by the carbazole moieties acting as charge traps and a hopping process using the carbazole charge-trap sites as stepping-stones.
AB - The mechanism behind electrical memory behavior of carbazole-containing polyimides (PIs) in nanoscale thin films was investigated. For this investigation, a series of poly(3,3′-dihydroxy-4,4′-biphenylene-co-3,3′-bis(N-ethylenyloxycarbazole)-4,4′-biphenylene hexafluoro-isopropylidenedi-phthalimide)s (6F-HAB-HABCZn PIs) with various compositions was synthesized as a model carbazole-containing polymer system. The thermal properties, band gaps, and molecular orbital levels of the PIs were determined. Furthermore, the chemical compositions, as well as the nanoscale thin film morphologies and electron densities, were analyzed, providing detailed information on the population and positional distribution of carbazole moieties in thin films of the PIs. PI Devices were fabricated with aluminum electrodes and tested electrically. The PI thin film layers in the devices exhibited electrically permanent memory behavior, which was driven by trap-limited space-charge limited conduction and ohmic conduction. The permanent memory characteristics were found to be attributed to the incorporated carbazole moieties rather than from the other chemical components. Furthermore, the memory characteristics depended significantly on the population and positional distribution of carbazole moieties in the PI layer, as well as the film thickness. Considering that the backbone is not conjugated, the present results collectively indicate that the electrical switching behavior of the PI films is driven by the carbazole moieties acting as charge traps and a hopping process using the carbazole charge-trap sites as stepping-stones.
KW - carbazole distribution denpendency
KW - carbazole population dependency
KW - carbazole-containing polyimide
KW - charge hoping process
KW - charge-trap
KW - digital memory device
KW - film thickness dependency
KW - memory mechanism
KW - nonvolatile memory characteristics
UR - http://www.scopus.com/inward/record.url?scp=84917691438&partnerID=8YFLogxK
U2 - 10.1021/am506915n
DO - 10.1021/am506915n
M3 - Article
AN - SCOPUS:84917691438
SN - 1944-8244
VL - 6
SP - 21692
EP - 21701
JO - ACS Applied Materials and Interfaces
JF - ACS Applied Materials and Interfaces
IS - 23
ER -